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TMP708 数据表(PDF) 2 Page - Texas Instruments

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部件名 TMP708
功能描述  Resistor-Programmable Temperature Switch in SOT Package
PDF  14 Pages
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制造商  TI1 [Texas Instruments]
网页  http://www.ti.com
标志 TI1 - Texas Instruments

TMP708 数据表(HTML) 2 Page - Texas Instruments

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TMP708
SBOS585A
– DECEMBER 2011 – REVISED FEBRUARY 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION(1)
PACKAGE
PRODUCT
PACKAGE-LEAD
DESIGNATOR
PACKAGE MARKING
ORDERING NUMBER
TMP708AIDBVR
TMP708
SOT23-5
DBV
SBI
TMP708AIDBVT
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
TMP708
UNIT
Supply voltage range (VCC)
–0.3 to 6
V
Input voltage range (SET and HYST)
–0.3 to (VCC + 0.3)
V
Output voltage range (OT)
–0.3 to 6
V
Input current
20
mA
Output current
20
mA
Operating temperature, TA
–40 to +125
°C
Storage temperature, Tstg
–65 to +150
°C
Junction temperature, TJ
+150
°C
Human body model (HBM)
4000
V
ESD ratings
Charged device model (CDM)
1000
V
Machine model (MM)
200
V
(1)
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
THERMAL INFORMATION
TMP708
THERMAL METRIC(1)
DBV (SOT23)
UNITS
5 PINS
θJA
Junction-to-ambient thermal resistance
217.9
θJCtop
Junction-to-case (top) thermal resistance
86.3
θJB
Junction-to-board thermal resistance
44.6
°C/W
ψJT
Junction-to-top characterization parameter
4.4
ψJB
Junction-to-board characterization parameter
43.8
θJCbot
Junction-to-case (bottom) thermal resistance
N/A
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
Submit Documentation Feedback
Copyright
© 2011–2012, Texas Instruments Incorporated
Product Folder Link(s): TMP708



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