ExampleBoardLayout

StencilOpenings

BasedonStencilThickness

of0,127mm(.005in)

TLV702xx

SLVSAG6B

– SEPTEMBER 2010 – REVISED FEBRUARY 2011

www.ti.com

(1)

All linear dimensions are in millimeters.

(2)

Customers should place a note on the circuit board fabrication drawing not to alter the center solder mask defined

pad.

(3)

Publication IPC-7351 is recommended for alternate designs.

(4)

Laser-cutting apertures with trapedzoidal walls and also rounding corners will offer better paste release. Customers

should contact their board assembly site for stencil design recommendations. Example stencil design based on a 50%

volumetric load solder paste. Refer to IPC-7525 for other stencil recommendations.

Figure 29. Recommended Land Pattern for DBV Package

14

Submit Documentation Feedback

© 2010–2011, Texas Instruments Incorporated