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AS1720

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only, and functional operation of

the device at these or any other conditions beyond those indicated in Section 6 Electrical Characteristics on page 4 is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

Table 3. Absolute Maximum Ratings

Parameter

Min

Max

Units

Notes

Electrical Parameters

VDDHV, OUT

-0.9

+55

V

VDDA, DUTY, ENN, IE, IH

-0.3

+5

V

Input Current (latch-up immunity)

-100

100

mA

Norm: JEDEC 78 @85°C

Electrostatic Discharge

Electrostatic Discharge HBM

+/- 1.5

kV

Norm: MIL 883 E method 3015

Temperature Ranges and Storage Conditions

Thermal Resistance

+36

ºC/W

+140

ºC

Internally limited

Storage Temperature Range

-55

+150

ºC

Package Body Temperature

+260

ºC

The reflow peak soldering temperature (body

temperature) specified is in accordance with IPC/

JEDEC J-STD-020 “Moisture/Reflow Sensitivity

Classification for Non-Hermetic Solid State

Surface Mount Devices”.

The lead finish for Pb-free leaded packages is

matte tin (100% Sn).

Humidity

5

85

%

Non-condensing

Moisture Sensitive Level

1

Represents a max. floor life time of unlimited