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LTC3261

3261f

ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating

temperature range, otherwise specifications are at TA = 25°C (Note 2). VIN = EN = 12V, MODE = 0V, RT = 200kΩ.

SYMBOL

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

Charge Pump

VIN

Input Voltage Range

4.5

VUVLO

VIN Undervoltage Lockout Threshold

VIN Rising

VIN Falling

3.4

3.8

3.6

IVIN

VIN Quiescent Current

Shutdown, = EN = 0V

MODE = VIN, IVOUT = 0mA

MODE = 0V, IVOUT = 0mA

3.5

120

5.5

μA

VRT

RT Regulation Voltage

1.200

VOUT

VOUT Regulation Voltage

MODE = 12V

MODE = 0V

–0.94 • VIN

–VIN

fOSC

Oscillator Frequency

RT = GND

450

500

550

KHz

ROUT

Charge Pump Output Impedance

MODE = 0V, RT = GND

ISHORT_CKT

Max IVOUT Short-Circuit Current

VOUT = GND, RT = GND

100

160

250

VMODE(H)

MODE Threshold Rising

1.1

VMODE(L)

MODE Threshold Falling

0.4

1.0

IMODE

MODE Pin Internal Pull-Down Current

VIN = MODE = 32V

0.7

μA

VEN(H)

EN Threshold Rising

1.1

VEN(L)

EN Threshold Falling

0.4

1.0

IEN

EN Pin Internal Pull-Down Current

VIN = EN = 32V

0.7

μA

Note 1: Stresses beyond those listed under Absolute Maximum Ratings

may cause permanent damage to the device. Exposure to any Absolute

Maximum Rating condition for extended periods may affect device

reliability and lifetime.

Note 2: The LTC3261 is tested under pulsed load conditions such that

TJ ≈ TA. The LTC3261E is guaranteed to meet specifications from

0°C to 85°C junction temperature. Specifications over the –40°C to

125°C operating junction temperature range are assured by design,

characterization and correlation with statistical process controls. The

LTC3261I is guaranteed over the –40°C to 125°C operating junction

temperature range. High junction temperatures degrade operating

lifetimes; operating lifetime is derated for junction temperatures greater

than 125°C. Note that the maximum ambient temperature consistent with

these specifications is determined by specific operating conditions in

conjunction with board layout, the rated package thermal impedance and

other environmental factors.

The junction temperature (TJ, in °C) is calculated from the ambient

temperature (TA, in °C) and power dissipation (PD, in Watts) according to

the formula:

TJ = TA + (PD • θJA),

where θJA = 40°C/W is the package thermal impedance.

Note 3: This IC includes overtemperature protection that is intended

to protect the device during momentary overload conditions. Junction

temperatures will exceed 150°C when overtemperature protection is

active. Continuous operation above the specified maximum operating

junction temperature may result in device degradation or failure.

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