Analog Integrated Circuit Device Data

Freescale Semiconductor

13

MM912_P812

PIN CONNECTIONS

MAXIMUM RATINGS

MAXIMUM RATINGS

ANALOG MC33812 PARAMETRICS

The detailed MC33812 specifications can be found in the MC33812 data sheet. See MC33812.

MICROCONTROLLER S12P PARAMETRICS

The detailed S12P specifications can be found in the MC9S12P128 reference manual. See MC9S12P128.

Table 5. MM912_P812 Maximum Ratings

All voltages are with respect to ground, unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Symbol

Rating

Value

Unit

Notes

ELECTRICAL RATINGS

ESD Voltage

Human Body Model

Machine Model

Charge Device Model (Corner pins)

Charge Device Model

±2000

±200

±750

±500

V

(11)

THERMAL RATINGS

Operating Temperature

Ambient

Junction

Case

-40 to 125

-40 to 150

-40 to 125

Storage Temperature

-55 to 150

1.7

W

(14)

Peak Package Reflow Temperature During Solder Mounting

Note 13

(12), (13)

Thermal Resistance

Junction-to-Ambient

Junction- to-Lead

Junction-to-Flag

75

8.0

1.2

°C/W

Notes

11.

12.

Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

13.

Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes

and enter the core ID to view all orderable parts (i.e. MC33xxxD enter 33xxx), and review parametrics.

14.

This parameter is guaranteed by design but is not production tested.