TLE 4470

Semiconductor Group

21

1998-11-01

Package Outlines

1.27

17

14

8

0.35 x 45˚

-0.2

4

0.1

Index Marking

1)

+0.15

0.35

2)

2) Does not include dambar protrusion of 0.05 max. per side

1) Does not include plastic or metal protrusion of 0.15 max. per side

0.2 14x

1)

GPS05093

P-DSO-14-4

(Plastic Dual Small Outline)

Sorts of Packing

Package outlines for tubes, trays etc. are contained in our

Data Book “Package Information”.

Dimensions in mm

SMD = Surface Mounted Device