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SP4412 数据表(PDF) 2 Page - Sipex Corporation |
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SP4412 数据表(HTML) 2 Page - Sipex Corporation |
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2 / 10 page ![]() SP4412ADS/12 SP4412ACN Electroluminescent Lamp Driver © Copyright 2000 Sipex Corporation 2 NOTES: 1. Dimensions are in microns unless otherwise noted (mils) 2. Bonding pads are 125 x 125 microns typical 3. Outside dimensions are maximum including scribe area 4. Die thickness is 15 mils +/- 1 5. Pad center coordinates are relative to the die center. Measured from center of Pads. 1397 (55) Coil Lamp 2 Lamp 1 Clk. V DD V SS Y X (0,0) 1143 (45) HON SPECIFICATIONS T= 25 °C; V DD = 3.0V; Lamp Capacitance = 2000pF; Coil = 30 mH at 125 Ohms; External Oscillator = 32768Hz (unless otherwise noted). ABSOLUTE MAXIMUM RATINGS These are stress ratings only and functional operation of the device at these ratings or any other above those indicated in the operation sections of the specifications below is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability. V DD..................................................................................................5.0 V Input Voltages/Currents HON (pin 1).........................................-0.5V to (V DD+0.5V) COIL (pin 3)..............................................................60mA Lamp Outputs...............................................................................250V PP Storage Temperature.....................................................-65˚C to +150˚C Power Dissipation Per Package 8-pin NSOIC (derate 6.14mWoC above +70oC)...................................500mW 8-pin µSOIC (derate 4.85mWoC above +70oC)....................................390mW The information furnished herein by Sipex has been carefully reviewed for accuracy and reliability. Its application or use, however, is solely the responsibility of the user. No responsibility for the use of this information is assumed by Sipex, and this information shall not explicitly or implicitly become part of the terms and conditions of any subsequent sales agreement with Sipex. Specifications are subject to change without prior notice. By the sale or transfer of this information, Sipex assumes no responsibility for any infringement of patents or other rights of third parties which may result from its use. No license or other proprietary rights are granted by implication or otherwise under any patent or patent rights of Sipex Corporation. BONDING DIAGRAM PIN X Y CLK 218.5 555.5 HON 418.5 555.5 V DD 418.5 339.5 EL2 -178.0 -555.5 EL1 95.5 -555.5 COIL -416.0 -555.5 -416.0 219.0 R E T E M A R A P. N I M. P Y T. X A MS T I N US N O I T I D N O C V , e g a t l o V y l p p u S D D 2 . 20 . 36 . 3V , t n e r r u C y l p p u SI L I O C I + D D 50 . 2A mV N O H V = D D V 3 = V , e g a t l o V li o C L I O C V D D 6 . 3 V V , e g a t l o V t u p n I N O H N O H f f o L E : W O L n o L E : H G I H 5 2 . 0 - V D D 5 2 . 0 - 0 V D D V 5 2 . 0 V D D 5 2 . 0 + V n o L E , t n e r r u C N O H1 0 10 0 1 µA I , t n e r r u C n w o d t u h S D S I = L I O C I + D D 0 10 5A nV N O H V 0 = E V I R D R O T C U D N I f , y c n e u q e r F li o C L I O C f = P M A L 2 3 x2 9 1 8z Hz H 8 6 7 2 3 = r o t a ll i c s O t u p n I e l c y C y t u D li o C5 7% I , t n e r r u C li o C k a e P L I O C - K P 0 6A m. n g i s e d y b d e e t n a r a u G T U P T U O P M A L L E f , y c n e u q e r F p m a L L E P M A L 6 5 2z Hz H 8 6 7 2 3 = r o t a ll i c s O t u p n I e g a t l o V t u p t u O k a e P o t k a e P0 2 10 6 1V P P V SS |
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