SP4425DS/20

SP4425 Electroluminescent Lamp Driver

© Copyright 2000 Sipex Corporation

3

(T= 25

°C; V

V

SS

HON

D1

Coil

C

OSC

73 x 46

MS666

EL2

V

DD

EL1

NOTES:

1. Dimensions are in Microns unless otherwise noted.

2. Bonding pads are 125x125 typical.

3. Outside dimensions are maximum, including scribe area.

4. Die thickness is 10 mils +/- 1.

5. Pad center coordinates are relative to die center.

6. Die size 74 x 44 mils.

This data sheet specifies environmental parameters, final test conditions and limits as well suggested operating conditions.

For applications which require performance beyond the specified condition and or limits please consult the factory.

Bonding Diagram:

PAD

X

Y

261.0

427.0

EL1

813.0

429.0

EL2

813.0

28.0

D1

813.0

-172.0

COIL

767.0

-381.0

143.5

-412.0

-790.0

-157.5

HON

-785.5

402.0

R

E

T

E

M

A

R

A

P.

N

I

M.

P

Y

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X

A

MS

T

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N

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OSC