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SP4501 数据表(PDF) 2 Page - Sipex Corporation |
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SP4501 数据表(HTML) 2 Page - Sipex Corporation |
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2 / 13 page ![]() 11-14-00 SP4501 EL Plus Piezo Driver © Copyright 2000 Sipex Corporation 2 SPECIFICATIONS V DD = +3.0V, L = 470µH, CLAMP = 8nF, CPZ = 16nF, CINT = 1800pF ROSC = 500kΩ, and TAMB = 25˚C unless otherwise noted. STORAGE CONSIDERATIONS Storage in a low humidity environment is preferred. Large high density plastic packages are moisture sen- sitive and should be stored in Dry Vapor Barrier Bags. Prior to usage, the parts should remain bagged and stored below 40 °C and 60%RH. If the parts are removed from the bag, they should be used within 48 hours or stored in an environment at or below 20%RH. If the above conditions cannot be followed, the parts should be baked for four hours at 125 °C in order remove moisture prior to soldering. Sipex ships prod- uct in Dry Vapor Barrier Bags with a humidity indicator card and desiccant pack. The humidity indicator should be below 30%RH. ABSOLUTE MAXIMUM RATINGS These are stress ratings only and functional operation of the device at these ratings or any other above those indicated in the operation sections of the specifications below is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability. Power Supply, V DD.................................................7.0V Input Voltages, Logic.....................-0.3V to (V DD+0.3V) Lamp Outputs...................................................220V P-P Operating Temperature.........................-40˚C to +85˚C Storage Temperature..........................-65˚C to +150˚C Power Dissipation Per Package 14-pin SOIC (derate 8.33mW/˚C above +70˚C)....................700mW 14-pin TSSOP (derate 9.96mW/˚C above +70˚C)....................800mW The information furnished by Sipex has been carefully reviewed for accuracy and reliability. Its application or use, however, is solely the responsibility of the user. No responsibility for the use of this information become part of the terms and conditions of any subsequent sales agreement with Sipex. Specifications are subject to change without no responsibility for any infringement of patents or other rights of third parties which may result from its use. No license or other proprietary rights are granted by implication or otherwise under any patent or patent rights of Sipex Corporation. R E T E M A R A P. N I M. P Y T. X A M S T I N U S N O I T I D N O C V , e g a t l o V y l p p u S D D 2 . 20 . 30 . 6 V , t n e r r u C y l p p u SI L I O C I + D D 8 28 40 9 A m L L I O C 0 7 4 = µF t n e r r u C y b d n a t S1 . 0 µA r o f e g a t l o V t u p n I K C Z P , K C Z P , N E Z P d n a N E L E W O L H G I H5 7 . 2 0 0 . 3 5 2 . 0V e c n a d e p m I t u p n I K C Z P d n a N E L E K C Z P d n a N E Z P 1M Ω V N E L E V 0 = e v i r D r o t c u d n I f , y c n e u q e r F li o C C S O 0 . 7 37 . 5 47 . 4 5 z H k f f o e l c y C y t u D C S O 0 9 % t n e r r u C li o C k a e P0 0 1 A m t u p t u O r e v i r D o z e i P / p m a L L E V , e g a t l o V t u p t u O o z e i P Z P 5 2 V f o z e i p ; H G I H = N E Z P , z H k 1 . 3 = T B M A 5 2 + = OC T B M A 0 4 - = O 5 8 + o t C OC V , e g a t l o V t u p t u O p m a L L E 0 1 1 V T B M A 5 2 + = OC T B M A 0 4 - = O 5 8 + o t C OC f , y c n e u q e r F p m a L L E P M A L 9 8 27 5 37 2 4 z H T B M A 5 2 + = OC T B M A 0 4 - = O 5 8 + o t C OC f , y c n e u q e r F o z e i P Z P 3 . 29 . 24 . 3 z H k ; H G I H = N E Z P T B M A 5 2 + = OC T B M A 0 4 - = O 5 8 + o t C OC 1.0 |
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