MPXA6115A

Sensors

4

Freescale Semiconductor

Figure 1. Fully Integrated Pressure Sensor Schematic

On-chip Temperature Compensation and Calibration

Super Small Outline chip carrier (Case 1317).

current operation).

pressure input. Typical minimum and maximum output

curves are shown for operation over 0

° to 85°C temperature

range. The output will saturate outside of the rated pressure

range.

A fluorosilicone gel isolates the die surface and wire bonds

from the environment, while allowing the pressure signal to

be transmitted to the silicon diaphragm. The MPXxx6115A

series pressure sensor operating characteristics, internal

reliability and qualification tests are based on use of dry air as

the pressure media. Media other than dry air may have

adverse effects on sensor performance and long-term

reliability. Contact the factory for information regarding media

compatibility in your application.

Figure 2. Cross Sectional Diagram SSOP/SOP (not to scale)

Figure 3. Typical Application Circuit

(Output Source Current Operation)

Pins 1, 5, 6, 7, and 8 are NO CONNECTS

Sensing

Element

Gain Stage #2

GND

and Ground

Reference

Shift

Circuitry

Thin Film

Temperature

Compensation

and

Gain Stage #1

3

2

4

Wire Bond

Stainless

Steel Cap

Thermoplastic

Case

Die Bond

Sealed Vacuum Reference

Fluorosilicone

Gel Die Coat

Lead

Frame

Absolute Element

P1

Die

+5.0 V

GND Pin 3

MPXxx6115A

to ADC

100 nF

51 K

47 pF