21

Atmel AT24CS01/02 [PRELIMINARY DATASHEET]

8815A–SEEPR–6/12

14.4 5TS1 — 5-lead SOT23

DRAWING NO.

REV.

TITLE

GPC

Package Drawing Contact:

packagedrawings@atmel.com

5TS1

D

5/31/12

5TS1, 5-lead 1.60mm Body, Plastic Thin

Shrink Small Outline Package (Shrink SOT)

TSZ

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL

MIN

NOM

MAX

NOTE

A

-

-

1.00

A1

0.00

-

0.10

A2

0.70

0.90

1.00

c

0.08

-

0.20

3

D

2.90 BSC

1,2

E

2.80 BSC

1,2

E1

1.60 BSC

1,2

L1

0.60 REF

e

0.95 BSC

e1

1.90 BSC

b

0.30

-

0.50

3,4

1. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash,

protrusions or gate burrs shall not exceed 0.15 mm per end. Dimension E1 does

not include interlead flash or protrusion. Interlead flash or protrusion shall not

exceed 0.15 mm per side.

2. The package top may be smaller than the package bottom. Dimensions D and E1

are determined at the outermost extremes of the plastic body exclusive of mold

flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch

between the top and bottom of the plastic body.

3. These dimensions apply to the flat section of the lead between 0.08 mm and 0.15

mm from the lead tip.

4. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion

shall be 0.08 mm total in excess of the "b" dimension at maximum material

condition. The dambar cannot be located on the lower radius of the foot. Minimum

space between protrusion and an adjacent lead shall not be less than 0.07 mm.

This drawing is for general information only. Refer to JEDEC

Drawing MO-193, Variation AB for additional information.

5

4

2

L1

L

C

END VIEW

C

A

A2

A1

b

e

PLANE

SEATING

D

SIDE VIEW

E

e1

E1

3

1

TOP VIEW