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SW38-2G 数据表(PDF) 9 Page - Aavid, Thermal Division of Boyd Corporation |
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SW38-2G 数据表(HTML) 9 Page - Aavid, Thermal Division of Boyd Corporation |
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9 / 116 page  9 EUROPE ASIA Italy Tel: +39 051 764011 email: sales.it@aavid.com United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com www.aavidthermalloy.com The basic equation for heat transfer or power dissipation may be stated as follows: Where: PD = the power dissipated by the semiconductor device in watts. ΔT = the temperature difference of driving potential which causes the flow of heat. ΣRθ = the sum of the thermal resistances of the heat flow path across which ΔT exists. The above relationship may be stated in the following forms: The above equations are generally used to determine the required thermal resistance of the heat sink (RθSA), since the heat dissipation, maximum junction and/or case temperature, and ambient temperature are known or set. How To Select a Heat Sink Where: TJ = the junction temperature in °C (maximum is usually stated by the manufacturer of the semiconductor device). TC = case temperature of the semiconductor device in °C. TS = temperature of the heat sink mounting surface in thermal contact with the semiconductor device in °C. TA = ambient air temperature in °C. RθJC = thermal resistance from junction to case of the semiconductor device in °C per watt (usually stated by manufacturer of semiconductor device). RθCS = thermal resistance through the interface between the semiconductor device and the surface on which it is mounted in °C per watt. RθSA = thermal resistance from mounting surface to ambient or thermal resistance of heat sink in °C per watt. Figure 1 indicates the location of the various heat flow paths, temperatures and thermal resistances. The common practice is to represent the system with a network of resistances in series as shown in Figure 2. Atmosphere or ambient Mounting surface (cooler/dissipator) Semiconductor case Junction (heat source) Interface Heat flow path mounting surface to ambient, equation (3) Heat flow path case to ambient equation (2) Heat flow path junction to ambient, equation (1) P D P D T A R θSA R θCS R θJC T S T C T A T J TJ–TA PD = RθJC + RθCS + RθSA TC–TA PD = RθCS + RθSA TS–TA PD = RθSA Δ T PD = ΣRθ RθCS RθJC TS TA TJ RθSA TC FIGURE 1 FIGURE 2 How to select a heat sink |
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