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SSL2115X 数据表(PDF) 15 Page - NXP Semiconductors |
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SSL2115X 数据表(HTML) 15 Page - NXP Semiconductors |
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15 / 15 page ![]() NXP Semiconductors SSL2115X Low-cost non-dimmable LED driver IC © NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 7 June 2012 Document identifier: SSL2115X Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 5 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Functional description . . . . . . . . . . . . . . . . . . . 4 8.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8.2 Current source operation . . . . . . . . . . . . . . . . . 4 8.3 Leading-Edge Blanking (LEB) . . . . . . . . . . . . . 5 8.4 dV/dt detection . . . . . . . . . . . . . . . . . . . . . . . . . 5 8.5 Turn-off-time (toff) . . . . . . . . . . . . . . . . . . . . . . . 5 8.6 Supply concepts VCC and UnderVoltage LockOut (UVLO) . . . . . . . . . . . . . . . . . . . . . . . . 5 8.7 Peak current detection . . . . . . . . . . . . . . . . . . . 5 8.8 LED OverTemperature Protection (OTP) . . . . . 5 8.9 LED Output Short-circuit Protection (OSP). . . . 5 8.10 Output LED open-circuit protection . . . . . . . . . 5 8.11 Operational limits . . . . . . . . . . . . . . . . . . . . . . . 6 9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7 10 Thermal characteristics . . . . . . . . . . . . . . . . . . 7 11 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 8 12 Application information. . . . . . . . . . . . . . . . . . . 9 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 14 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 11 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13 16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 16.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 16.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 17 Contact information. . . . . . . . . . . . . . . . . . . . . 14 18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 |
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