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3.3

Wafer Map File

Format

HGWY5 0020_20041001114135.cp3

Wafer lot #

Qty wafers

Date-time

3.4

Ink Dot Specification

Wafer Map File

All lots are supplied with wafer mapping file. This mapping file is stored on a CD and enclosed in the pack

box.

The mapping file is stored for 3 years, if any problem might occur. We handle our TI world wide wafer map

standard. The wafer file name is explained as follows:

Wafer map files are provided in a TI Worldwide (WW) format, which is in ASCII text form. An example of

the TI WW wafer map file is shown below. Contact your sales representative to obtain details on the TI

WW format.

FACILITY=UMC-F8E

LOT=HGWY5

DEVICE=$8TMS37114APK

WAFERS=20

X_SIZE=074.134

Y_SIZE=083.858

BIN_NAME.01="G,PASS"

BIN_NAME.09="FAIL"

STATUS="PROD"

SCRIBE="BOTTOM,15,NTRL,FAB"

WAFER_SIZE=200

WAFERID.01=LT5000200-13-E0

NUM_BINS.01=01

BIN_COUNT.01.01=02463

MAP_XY.01.01="Y-10 19 15 12 10/8

Y-9 20 18 15 13/12 9/7

Y-8 20/14 12/10 8/6 3

Y-7 15/13 10 8 4 2"

All Tag-it HF-I Pro Transponder ICs are electrically tested and dies that fail the probe test will be inked.

Bump failures are not marked with an ink dot.

Table 3-1. Ink Dot Specification

Parameter

Value

Min 250

μm

Diameter

Max 600

μm

Height

Max 25

μm

Colour

Black

Position

Central, not to touch bond pads

Shipping, Packing & Further Handling

20

SCBU045 (11-09-21-065) – October 2007

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