TPS51916

SLUSAE1D – DECEMBER 2010 – REVISED JUNE 2012

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERABLE DEVICE

OUTPUT

MINIMUM

PACKAGE

PINS

NUMBER

SUPPLY

QUANTITY

TPS51916RUKR

Tape and reel

3000

–40°C to 85°C

Plastic Quad Flat Pack (QFN)

20

TPS51916RUKT

Mini reel

250

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

VALUE

UNIT

MIN

MAX

VBST

–0.3

36

–0.3

6

SW

–5

30

VLDOIN, VDDQSNS, REFIN

–0.3

3.6

V

VTTSNS

–0.3

3.6

PGND, VTTGND

–0.3

0.3

V5IN, S3, S5, TRIP, MODE

–0.3

6

DRVH

–5

36

–0.3

6

VTTREF, VREF

–0.3

3.6

V

VTT

–0.3

3.6

DRVL

–0.3

6

PGOOD

–0.3

6

125

°C

–55

150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to the network ground terminal unless otherwise noted.

(3)

Voltage values are with respect to the SW terminal.

THERMAL INFORMATION

TPS51916

THERMAL METRIC

UNITS

QFN (20) PINS

Junction-to-ambient thermal resistance

94.1

Junction-to-case (top) thermal resistance

58.1

Junction-to-board thermal resistance

64.3

°C/W

Junction-to-top characterization parameter

31.8

Junction-to-board characterization parameter

58.0

Junction-to-case (bottom) thermal resistance

5.9

2

Submit Documentation Feedback

Copyright © 2010–2012, Texas Instruments Incorporated