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ASG330 数据表(PDF) 2 Page - Advanced Semiconductor Business Inc. |
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ASG330 数据表(HTML) 2 Page - Advanced Semiconductor Business Inc. |
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2 / 9 page ![]() 2/9 November 2007 a Function Pin No. Input 1 Ground 2 Output 3 (Unit: mm) ASG330 Outline Drawing Pin Description (Unit: mm) 1 2 3 2 Mounting Configuration Note : 1. Ground vias are critical for thermal and RF grounding considerations. 2. If your PCB design rules allow, ground vias should be placed under bottom of pin 2 for better RF and thermal performance. |
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