STPS6045HR datasheet(3/8 Pages) STMICROELECTRONICS

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STPS6045HR

Characteristics

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Table 4.

Electrical measurements at ambiant temperature (per diode), Tamb = 22 ±3 °C

Symbol

Characteristic

MIL-STD-750

test method

Test conditions

Values

Units

Min.

Max.

Reverse current

4016

DC method, VR = 45V

500

µA

VF1

(1)

Forward voltage

4011

Pulse method, IF = 5 A

520

(1)

Pulse method, IF = 10 A

590

VF3(1)

Pulse method, IF = 20 A

650

VF4(1)

Pulse method, IF = 35 A

820

Capacitance

4001

VR = 5 V, F = 1 MHz

1.3

Zth(j-c)

(2)

Relative thermal impedance,

junction to case

3101

IH = 15 to 40 A, tH = 50 ms

IM = 50 mA, tmd = 100 µs

Calculate

ΔVF(3) °C/W

Pulse width

≤ 300 µs, Duty Cycle ≤ 2%

Performed only during screening tests parameter drift values (initial measurements), go-no-go

The limits for

ΔVF shall be defined by the manufacturer on every lot in accordance with MIL-STD-750 Method 3101 and

shall guarantee the Rth(j-c) limits specified in maximum ratings.

Table 5.

Electrical measurements at high and low temperatures (per diode)

Symbol

Characteristic

MIL-STD-750

test method

Test conditions(1)

Values

Units

Min.

Max.

Reverse current

4016

Tcase = +125 (+0, -5) °C

DC method, VR = 45 V

-40

VF2

(2)

Forward voltage

4011

Tcase = +125 (+0, -5) °C

pulse method, IF = 10 A

-530

VF3(2)

Tcase = +125 (+0, -5) °C

pulse method, IF = 20 A

-610

Tcase = -55 (+0, -5) °C

pulse method, IF = 20 A

-800

VF4(2)

Tcase = +125 (+0, -5) °C

pulse method, IF = 35 A

-790

Read and record measurements shall be performed on a sample of 5 components with 0 failures allowed. Alternatively a

100% inspection may be performed.

Pulse width

≤ 300 µs, duty cycle ≤ 2%

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