TS4999

Package mechanical data

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5

Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

5.1

Flip chip package

Figure 62.

Flip chip package

866

μm

866

μm

500

μm

750

μm

2420

μm

2280

μm

600

μm

40

μm*

866

μm

866

μm

500

μm

750

μm

2420

μm

2280

μm

600

μm

40

μm*

Die size: 2.42x2.28 mm ± 100µm

Die height (including bumps): 600µm

Bumps diameter: 315µm ±50µm

Bump diameter before reflow: 300µm ±10µm

Bumps height: 250µm ±40µm

Die height: 350µm ±20µm

Pitch: 500µm ±50µm

Coplanarity: 50µm max

Optional*: Back coating height: 40µm