M48T58, M48T58Y

Maximum ratings

Doc ID 2412 Rev 8

21/33

7

Maximum ratings

Stressing the device above the rating listed in the absolute maximum ratings table may

cause permanent damage to the device. These are stress ratings only and operation of the

device at these or any other conditions above those indicated in the operating sections of

this specification is not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

Table 6.

Absolute maximum ratings

Caution:

Negative undershoots below –0.3 V are not allowed on any pin while in the battery backup

mode.

Caution:

Symbol

Parameter

Value

Unit

Ambient operating temperature

0 to 70

°C

–40 to 85

°C

(1)(2)(3)

1.

For DIP package, soldering temperature of the IC leads is to not exceed 260 °C for 10 seconds.

Furthermore, the devices shall not be exposed to IR reflow nor preheat cycles (as performed as part of

wave soldering). ST recommends the devices be hand-soldered or placed in sockets to avoid heat

damage to the batteries.

2.

For DIP packaged devices, ultrasonic vibrations should not be used for post-solder cleaning to avoid

damaging the crystal.

3.

For SOH28 package, lead-free (Pb-free) lead finish: reflow at peak temperature of 260°C (the time above

255°C must not exceed 30 seconds).

Lead solder temperature for 10 seconds

260

°C

Input or output voltages

–0.3 to 7

V

Supply voltage

–0.3 to 7

V

Output current

20

mA

Power dissipation

1

W