Package information

STA260

4/7

3

Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 2.

LFBGA (15x15x1.4mm 289 ball) mechanical data & package dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

mm

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

A

1.400

0.0551

A1

0.210

0.0083

A2

0.985

0.0387

A3

0.200

0.0078

A4

0.800

0.0315

b

0.350

0.400

0.450 0.0138 0.0157 0.0177

D

14.850 15.000 15.150 0.5846 0.5906 0.5965

D1

12.800

0.5039

E

14.850 15.000 15.150 0.5846 0.5906 0.5965

E1

12.800

0.5039

e

0.800

0.0315

F

1.100

0.0433

ddd

0.120

0.0047

eee

0.150

0.0059

fff

0.080

0.0031

LFBGA289

Low profile Fine Pitch Ball Grid Array

Body: 15 x 15 x 1.4mm

7963045 C