Characteristics

STPS140-Y

4/9

Doc ID 17973 Rev 1

Figure 7.

Relative variation of thermal

impedance junction to ambient

versus pulse duration (SMA)

Figure 8.

Relative variation of thermal

impedance junction to ambient

versus pulse duration (SMB)

1E-2

1E-1

1E+0

1E+1

1E+2

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

Z/R

th(j-c)

th(j-c)

T

tp

t (s)

p

δ = 0.5

δ = 0.2

δ = 0.1

Single pulse

Epoxy printed circuit board, copper thickness: 35 µm

reccomended pad layout

1E-2

1E-1

1E+0

1E+1

1E+2

1E+3

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

Z/R

th(j-c)

th(j-c)

T

tp

t (s)

p

δ = 0.5

δ = 0.2

δ = 0.1

Single pulse

Epoxy printed circuit board, copper thickness: 35 µm

reccomended pad layout

Figure 9.

Reverse leakage current versus

reverse voltage applied

(typical values)

Figure 10.

Junction capacitance versus

reverse voltage applied

(typical values)

0

5

10

15

20

25

30

35

40

1E-2

1E-1

1E+0

1E+1

1E+2

1E+3

I (µA)

R

V (V)

R

T =125°C

j

T =75°C

j

T =25°C

j

12

5

10

20

50

10

20

50

100

200

C(pF)

V (V)

R

F=1MHz

T =25°C

j

Figure 11.

Forward voltage drop versus

forward current (maximum values)

Figure 12.

Thermal resistance junction to

ambient versus copper surface

under each lead (SMA)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1E-2

1E-1

1E+0

1E+1

I

(A)

FM

V

(V)

FM

T =125°C

j

01

2

3

4

5

0

20

40

60

80

100

120

140

S(Cu)(cm²)

R

(°C/W)

th(j-a)

P=1.5W

Epoxy printed circuit board FR4, copper thickness: 35 µm

reccomended pad layout