STPS10L40C datasheet(4/9 Pages) STMICROELECTRONICS

4 / 9 page

Characteristics

STPS10L40C

4/9

Figure 7.

Relative variation of thermal

impedance junction to case versus

pulse duration

(TO-220AB and D2PAK)

Figure 8.

Relative variation of thermal

impedance junction to case versus

pulse duration

(TO-220FPAB)

1E-3

1E-2

1E-1

1E+0

0.0

0.2

0.4

0.6

0.8

1.0

Z/R

th(j-c)

δ=tp/T

t (s)

δ = 0.5

δ = 0.2

δ = 0.1

Single pulse

1E-3

1E-2

1E-1

1E+0

1E+1

0.0

0.2

0.4

0.6

0.8

1.0

Z/R

th(j-c)

δ=tp/T

t (s)

δ = 0.5

δ = 0.2

δ = 0.1

Single pulse

Figure 9.

Reverse leakage current versus

reverse voltage applied (typical

values, per diode)

Figure 10.

Junction capacitance versus

reverse voltage applied (typical

values, per diode)

Figure 11.

Forward voltage drop versus

forward current (maximum values,

per diode)

Figure 12.

Thermal resistance junction to

ambient versus copper surface

under tab (Epoxy printed circuit

board FR4, copper thickness:

35 µm) ( D2PAK)

1E-3

1E-2

1E-1

1E+0

1E+1

1E+2

I (mA)

V (V)

T =100°C

T =150°C

T =25°C

100

1000

C(pF)

V (V)

F=1MHz

=30mV

T =25°C

OSC

RMS

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

0.1

1.0

10.0

100.0

(A)

(V)

T =125°C

T =150°C

(typical values)

T =25°C

(°C/W)

th(j-a)

S(Cu)(cm²)

STPS10L40C 数据表(PDF) 4 Page - STMicroelectronics

STPS10L40C 数据表(HTML) 4 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6 7 8 9

数据表下载

链接网址

STPS10L40C 数据表(PDF) 4 Page - STMicroelectronics

STPS10L40C 数据表(HTML) 4 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6 7 8 9

数据表 下载

链接网址

数据表下载