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EMIF02-MIC06F3 数据表(PDF) 6 Page - STMicroelectronics |
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EMIF02-MIC06F3 数据表(HTML) 6 Page - STMicroelectronics |
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6 / 8 page ![]() Ordering information EMIF02-MIC06F3 6/8 Doc ID 15195 Rev 4 Figure 15. Flip Chip tape and reel specification 4 Ordering information Note: More information is available in the application notes AN2348: “Flip Chip: Package description and recommendations for use” AN1751: “EMI Filters: Recommendations and measurements” Figure 13. Footprint recommendations Figure 14. Marking 220µm recommended 220µm recommended 260µm maximum Solder stencil opening : Copper pad Diameter: Solder mask opening: 300µm minimum x y x w z w Dot, ST logo ECOPACK status xx = marking yww = datecode (y = year z = manufacturing location Dot identifying Pin A1 location User direction of unreeling All dimensions are typical values in mm 4.0 4.0 2.0 Ø 1.55 0.69 1.30 0.22 Table 3. Ordering information Order code Marking Package Weight Base qty Delivery mode EMIF02-MIC06F3 JB Flip Chip 1.8 mg 5000 Tape and reel 7” |
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