EMIF02-MIC07F3 datasheet(6/8 Pages) STMICROELECTRONICS

部件名	EMIF02-MIC07F3

功能描述	EMI filter and ESD protection

PDF	8 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

标志

6 / 8 page

Package information

EMIF02-MIC07F3

6/8

Doc ID 17052 Rev 3

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

Figure 11.

Flip-Chip package dimensions

Figure 12.

Footprint recommendations

Figure 13.

Marking

1.17 mm ± 30 µm

255 µm ± 40

185 µm

400 µm ± 40

605 µm ± 55

220µm recommended

260µm maxim um

Solder stencil opening:

Copper pad Diameter:

Solder mask opening:

300µm minimum

Dot, ST logo

xx = marking

ECOPAK status

yww = datecode

(y = year

ww = week)

z = manufacturing location

EMIF02-MIC07F3 数据表(PDF) 6 Page - STMicroelectronics