EMIF02-USB04F3

Package information

Doc ID 18144 Rev 1

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Package information

In order to meet environmental requirements, ST offers these devices in different grades of

specifications, grade definitions and product status are available at: www.st.com.

Figure 11.

Package dimensions

Figure 14.

Flip Chip tape and reel specification

Figure 12.

Footprint

Figure 13.

Marking

1.14 mm ± 30 µm

255 µm ± 40

400 µm ± 40

170 µm ± 10

500 µm ± 50

220 µm recommended

220 µm recommended

260 µm maximum

Solder stencil opening:

Copper pad Diameter:

Solder mask opening:

300 µm minimum

x

y

x

w

z

w

Dot, ST logo

xx = marking

yww = datecode

(y = year

ww = week)

z = manufacturing location

ECOPAK grade

User direction of unreeling

All dimensions in mm

4.0 ± 0.1

2.0 ± 0.05

Ø 1.5 ± 0.1

0.69 ± 0.05

1.24

4.0 ± 0.1

Dot identifying Pin A1 location