Package information

EMIF03-SIM03F3

6/8

Doc ID 16798 Rev 2

3

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

specifications, grade definitions and product status are available at: www.st.com.

Figure 14.

Package dimensions

Figure 17.

Flip-Chip tape and reel specification

Figure 15.

Footprint

Figure 16.

Marking

1.14 mm ± 30 µm

255 µm ± 40

400 µm ± 40

170 µm

605 µm ± 55

220 µm recommended

220 µm recommended

260 µm maximum

Solder stencil opening :

Copper pad Diameter:

Solder mask opening:

300 µm minimum

x

y

x

w

z

w

Dot, ST logo

ECOPACK status

xx = marking

yww = datecode

(y = year

ww = week)

z = manufacturing location

Dot identifying Pin A1 location

User direction of unreeling

All dimensions in mm

4.0 ± 0.1

4.0 ± 0.1

2.0 ± 0.05

Ø 1.55 ± 0.1

0.69 ± 0.05

1.24

0.20 ± 0.02