EMIF06-mSD02C3

Package information

Doc ID 16910 Rev 1

9/11

4

Package information

●

Epoxy meets UL94, V0

●

Lead-free package

In order to meet environmental requirements, ST offers these devices in different grades of

specifications, grade definitions and product status are available at: www.st.com.

Figure 18. Package dimensions

Figure 19.

Footprint

Figure 20.

Marking

1.54 mm ± 40 µm

255 µm ± 40

400 µm ± 40

170 µm ± 10

650 µm ± 60

220 µm recommended

220 µm recommended

260 µm maximum

Solder stencil opening:

Copper pad Diameter:

Solder mask opening:

300 µm minimum

x

y

z

w

x

w

Dot, ST logo

ECOPACK status

xx = marking

yww = datecode

y = year,

ww = week

z = manufacturing

location