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EMIF06-SD03F3 数据表(PDF) 21 Page - STMicroelectronics |
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EMIF06-SD03F3 数据表(HTML) 21 Page - STMicroelectronics |
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21 / 23 page ![]() EMIF06-SD03F3 Ordering information Doc ID 15194 Rev 2 21/23 Figure 21. Flip Chip tape and reel specifications 9 Ordering information Note: More information is available in the application notes: AN2348 :"Flip Chip : Package description and recommendations for use" AN1751 : EMI Filters: Recommendations and measurements Figure 19. Footprint recommendations Figure 20. Marking 220 µm recommended 220 µm recommended 260 µm maximum Solder stencil opening : Copper pad Diameter: Solder mask opening: 300 µm minimum x y x w z w Dot, ST logo ECOPACK status xx = marking yww = datecode (y = year ww = week) z = manufacturing location Dot identifying Pin A1 location User direction of unreeling All dimensions in mm 4.0 ± 0.1 4.0 ± 0.1 2.0 ± 0.05 Ø 1.55 ± 0.1 0.69 ± 0.05 2.25 0.20 ± 0.02 xxz xxz xxz ST ST ST yww yww yww Table 14. Ordering information Order code Marking Package Weight Base qty Delivery mode EMIF06-SD03F3 HY Flip Chip 5.46 mg 5000 Tape and reel (7”) |
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