M24LR16E-R datasheet(135/143 Pages) STMICROELECTRONICS

部件名	M24LR16E-R

功能描述	16-bit EEPROM with password protection, dual interface & energy harvesting: 400 kHz I²C bus & ISO 15693 RF protocol at 13.56 MHz

PDF	143 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

标志

135 / 143 page

M24LR16E-R

Package mechanical data

Doc ID 018932 Rev 8

135/143

Figure 88.

UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead

2 × 3mm, package outline

Drawing is not to scale.

The central pad (E2 × D2 area in the above illustration) is internally pulled to VSS. It must not be allowed to

be connected to any other voltage or signal line on the PCB, for example during the soldering process.

The circle in the top view of the package indicates the position of pin 1.

Table 128.

UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead

2 x 3 mm, data

Symbol

millimeters

inches(1)

Values in inches are converted from mm and rounded to 4 decimal digits.

Typ

Min

Max

Typ

Min

Max

0.550

0.450

0.600

0.0217

0.0177

0.0236

0.020

0.000

0.050

0.0008

0.0000

0.0020

0.250

0.200

0.300

0.0098

0.0079

0.0118

2.000

1.900

2.100

0.0787

0.0748

0.0827

D2 (rev MC)

1.200

1.600

0.0472

0.0630

3.000

2.900

3.100

0.1181

0.1142

0.1220

E2 (rev MC)

1.200

1.600

0.0472

0.0630

0.500

0.0197

0.300

0.0118

0.300

0.500

0.0118

0.0197

0.150

0.0059

0.300

0.0118

eee(2)

Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from

measuring.

0.080

0.0031

ZW_MEe

eee

Pin 1

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