M95160-R_12 datasheet(41/45 Pages) STMICROELECTRONICS

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M95160 M95160-W M95160-R M95160-F

Package mechanical data

Doc ID 022580 Rev 1

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Figure 21.

WLCSP-R 1.350 x 1.365 mm 0.4 mm pitch 8 bumps, package outline

Primary datum Z and seating plane are defined by the spherical crowns of the bump.

Drawing is not to scale.

Preliminary data.

Table 25.

WLCSP-R 1.350 x 1.365 mm 0.4 mm pitch 8 bumps, package mechanical

data (preliminary data)

Symbol

millimeters

inches(1)

Values in inches are converted from mm and rounded to four decimal digits.

Typ

Min

Max

Typ

Min

Max

0.545

0.490

0.600

0.0193

0.0215

0.0236

0.190

0.0075

0.355

0.014

b(2)

Dimension is measured at the maximum bump diameter parallel to primary datum Z.

0.270

0.240

0.300

0.0106

0.0094

0.0118

1.350

1.475

0.0531

0.0581

1.365

1.490

0.0537

0.0587

0.400

0.0157

0.800

0.0315

0.282

0.0111

0.275

0.0108

N (total number of

terminals)

aaa

0.110

0.0043

eee

0.060

0.0024

1C_ME

Wafer back side

Side view

Bump side

Detail A

Rotated 90˚

Seating plane

(see note 1)

Orientation

reference

Orientation

reference

Detail A

Bump

eee Z

aaa

(×4)

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