SS732/SS632

Hall Latch - High Sensitivity

information regarding manufacturability of Hall IC with different soldering processes

classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to

ethods:

Standard

Our products are

following test m

Reflow Soldering SMD’s (S

        

V2.00

May.1, 2012

                                                      

7

urface Mount Devices)

s according to table 5-2)

•

reconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing

efl

2)

Wave S

•

IPC/JEDEC J-STD-020

Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

(classification reflow profile

EIA/JEDEC JESD22-A113

P

(r ow profiles according to table

oldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)

•

EN6

o combined effect of moisture and soldering heat

•

EIA

Res

le mounted devices

Iro

0749-20

Resistance of plastic- encapsulated SMD’s t

/JEDEC JESD22-B106 and EN60749-15

istance to soldering temperature for through-ho

n Soldering THD’s (Through Hole Devices)

EN60749-15

•

es

g temperature for through-hole mounted devices

Soldera

R istance to solderin

bility SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)

•

Sol

ES

Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).

EIA/JEDEC JESD22-B102 and EN60749-21

derability

D Precautions