Production Data

WM9082

w

PD, August 2012, Rev 4.1

21

PACKAGE DIMENSIONS

PACKAGE DIAGRAM FOR DEVICES MARKED LT9

DM085.B

NOTES:

1. PRIMARY DATUM -Z- AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.

2. A1 CORNER IS IDENTIFIED BY INK/LASER MARK ON TOP PACKAGE.

3. ‘e’ REPRESENTS THE BASIC SOLDER BALL GRID PITCH.

4. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.

5. FOLLOWS JEDEC DESIGN GUIDE MO-211-C.

A1

0.230

D

D1

E

E1

e

1.000 BSC

1.460

0.275

1.000 BSC

0.500 BSC

1.560

Dimensions (mm)

Symbols

MIN

NOM

MAX

NOTE

A

0.635

A2

0.388

0.400

0.412

3

0.652

0.618

0.235

0.240

0.225

h

0.320

A1

CORNER

TOP VIEW

E

D

2

DETAIL 2

DETAIL 2

A

A2

A1

Z

1

SOLDER BALL

E1

A

DETAIL 1

C

B

e

e

BOTTOM VIEW

1

32

h

3

D1

0.05

4 X

4

4

DETAIL 1

1.550

1.450

1.470

1.570