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EP5348UI 数据表(PDF) 9 Page - Enpirion, Inc. |
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EP5348UI 数据表(HTML) 9 Page - Enpirion, Inc. |
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9 / 12 page ![]() 05721 September 12, 2012 Rev: C EP5348UI ©Enpirion 2012 all rights reserved, E&OE 9 www.enpirion.com sensing point so that it does not interfere with the control loop operation. Excess total capacitance on the output (Output Filter + Bulk) can cause an over-current condition at startup. Please see the Soft Start section under Functional Overview for the maximum allowable bulk capacitance on the output rail. The output capacitor must use a X5R or X7R or equivalent dielectric formulation. Y5V or equivalent dielectric formulations lose capacitance with frequency, bias, and temperature and are not suitable for switch- mode DC-DC converter output filter applications. LDO Replacement The Enpirion EP5348UI is a suitable replacement for inefficient LDOs and can be used to augment the LDOs in a PMU with minimum footprint impact. This integrated DCDC solution offers significantly better efficiency, and significant reduction in power loss. The resulting improved thermals and extended battery life helps meet Energy Star requirements. The total solution size is 25% smaller than a comparable LDO and half the footprint of a comparable DCDC. As the table below shows, EP5348UI provides the optimal trade-off between footprint and efficiency when compared to a traditional LDO: Power-Up/Down Sequencing During power-up, ENABLE should not be asserted before PVIN, and PVIN should not be asserted before AVIN. The PVIN should never be powered when AVIN is off. During power down, the AVIN should not be powered down before the PVIN. Tying PVIN and AVIN or all three pins (AVIN, PVIN, ENABLE) together during power up or power down meets these requirements . Pre-Bias Start-up The EP5348UI does not support startup into a pre-biased condition. Be sure the output capacitors are not charged or the output of the EP5348UI is not pre-biased when the EP5348UI is first enabled. Layout Recommendations Figure 4: Top PCB Layer Critical Components and Copper for Minimum Footprint Figure 5: Bottom PCB Layer Critical Components (RA, RB, CA) & Copper for Minimum Footprint VIN (V) VOUT (V) LOAD (mA) EFF DCDC EFF LDO PLOSS DCDC (mW) PLOSS LDO (mW) Power Saved (mW) 5.0 1.2 400 70.4% 24.0% 202 1520 1318 5.0 1.8 400 76.4% 36.0% 222 1280 1058 5.0 2.5 400 81.6% 50.0% 225 1000 775 5.0 3.3 400 87.7% 66.0% 185 680 495 3.3 1.2 400 77.1% 36.4% 143 840 697 3.3 1.8 400 83.3% 54.5% 144 600 456 3.3 2.5 400 88.2% 75.8% 134 320 186 |
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