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RT7253A 数据表(PDF) 13 Page - Richtek Technology Corporation |
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RT7253A 数据表(HTML) 13 Page - Richtek Technology Corporation |
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13 / 14 page ![]() RT7253A 13 DS7253A-02 March 2011 www.richtek.com (d) Copper Area = 50mm2 , θJA = 51°C/W (e) Copper Area = 70mm2 , θJA = 49°C/W Figure 6. Thermal Resistance vs. Copper Area Layout Design Figure 8. PCB Layout Guide Table 3. Suggested Capacitors for CIN and COUT Location Component Supplier Part No. Capacitance ( μF) Case Size CIN MURATA GRM31CR61E106K 10 1206 CIN TDK C3225X5R1E106K 10 1206 CIN TAIYO YUDEN TMK316BJ106ML 10 1206 COUT MURATA GRM31CR60J476M 47 1206 COUT TDK C3225X5R0J476M 47 1210 COUT MURATA GRM32ER71C226M 22 1210 COUT TDK C3225X5R1C22M 22 1210 Layout Considerations For best performance of the RT7253A, the following layout guidelines must be strictly followed. Input capacitor must be placed as close to the IC as possible. SW should be connected to inductor by wide and short trace. Keep sensitive components away from this trace. The feedback components must be connected as close to the device as possible VIN VOUT GND GND CP CC RC SW VOUT COUT L1 R1 R2 Input capacitor must be placed as close to the IC as possible. SW should be connected to inductor by wide and short trace. Keep sensitive components away from this trace. The feedback components must be connected as close to the device as possible. BOOT VIN SW GND SS EN FB COMP GND 2 3 4 5 6 7 8 9 CSS RS CS GND VIN REN CIN |
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