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数据搜索系统，热门电子元器件搜索 |
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数据搜索系统，热门电子元器件搜索 |
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DAMM15PC 数据表(PDF) 31 Page - ITT Industries |
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DAMM15PC 数据表(HTML) 31 Page - ITT Industries |
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31 / 301 page  Dimensions are shown in mm (inch) Dimensions subject to change 30 D Subminiature Cable Selection Guide D* — Solder Cup Termination (Machined) with Tin Shells D* solder cup connectors are used for cable or panel mount wiring applications. Solder cup connectors provide maximum flexibility and performance for applications requiring discrete solder terminations and field repair without termination tooling. Product Features Machined solder cup termination, 5 A current capacity High performance commercial class connectors Two contact performance classes Optional clinch nuts with #4-40 UNC or M3 threads ZD* — Solder Cup Termination (Stamped) with Tin Shells ZD* solder cup connectors are used for cable or panel mount wiring applications. Solder cup connectors provide maximum flexibility and performance for applications requiring discrete solder terminations. Product Features Stamped solder cup termination, 5 A current capacity Economical D*A — Crimp Connectors without Contacts D*A crimp contact connectors are designed for reliable, fast cabling. Available in the industry standard D*A housing, the connectors provide a low-cost, quick cabling alternative compared to soldering. Product Features Crimp contacts available in reels of 5,000 Application tooling: – Hand or automatic – Stripper crimper D*W — Discrete Wire IDC The D*W connector provides insulation displacement connection technology for either solid or stranded wires. With D*W, speed of cabling is increased significantly over solder cup or crimp solutions. Contacts are easily removable and replaceable. Several specialized accessories (including shield cans, ferrules, and plastic boots) are available to provide a complete product solution. Product Features Quick harnessing capability with simple hand or semi-automatic tooling Accepts 30 AWG to 20 AWG wire; sizes can be mixed Shield cans insure reliable shielding continuity See pages 32-33. See pages 34-35. See pages 36-37. See pages 38-41. |
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