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IRF830 数据表(PDF) 2 Page - Comset Semiconductor |
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IRF830 数据表(HTML) 2 Page - Comset Semiconductor |
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2 / 3 page ![]() IRF830 2/3 09/11/2012 COMSET SEMICONDUCTORS SEMICONDUCTORS ELECTRICAL CHARACTERISTICS TC=25°C unless otherwise noted Symbol Ratings Test Condition(s) Min Typ Max Unit VDSS Drain-Source Breakdown Voltage ID= 250 µA, VGS= 0 V 500 - - V VGS(th) Gate-threshold Voltage ID= 250 µA, VGS= VDS 2 3 4 V IDSS Zero Gate Voltage Drain Current VDS= 500 V, VGS= 0 V Tj= 25 °C - - 25 µA VDS= 500 V, VGS= 0 V Tj= 125 °C - - 250 IGSS Gate-Source leakage Current VGS= 20 V, VDS= 0 V - - 100 nA RDS(on) Drain-Source on Resistance ID= 2.7 A, VGS= 10 V - - 1.5 Ω DYNAMIC CHARACTERISTICS Symbol Ratings Test Condition(s) Min Typ Max Unit gfs Transconductance VDS >ID(on)*RDS(on)max ID= 2.5 A 2.5 - - S CISS Input Capacitance VGS= 0 V, VDS= 25 V f= 1MHz - - 800 pF COSS Output Capacitance - - 200 CRSS Reverse transfer Capacitance - - 60 td(on) Turn-on Delay Time VDD= 225 V, ID= 2.5 A, RGS= 15 Ω - - 30 ns tr Rise time - - 30 td(off) Turn-off Delay Time - - 55 tf Fall Time - - 30 REVERSE DIODE Symbol Ratings Test Condition(s) Min Typ Max Unit IS Inverse Diode Continuous Forward Current. TC = 25°C - - 4.5 A ISM Inverse diode direct current, pulsed. TC = 25°C - - 18 VSD Inverse Diode Forward voltage VGS = 0 V, IF = 4.5 A - - 1.6 V Trr Reverse Recovery Time IF = 3.1 A di/dt = 100 A/µs - 320 640 ns Qrr Reverse Recovery Charge - 1 2 µC |
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