DA6283.002

11 November, 2010

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PIN DESCRIPTION

Pin Description

Symbol

x-coordinate

y-coordinate

Crystal Oscillator Output

XOUT

214

141

Voltage Control Input

VC

885

142

Power Supply Ground

VSS

1080

141

Buffer Output

OUT

1106

699

Power Supply Voltage

VDD

579

698

Output Buffer Power Down Control

XPD

339

698

Crystal/Varactor Oscillator Input

XIN

153

698

Note: Because the substrate of the die is internally connected to VSS, the die has to be connected to VSS or left

floating. Please make sure that VSS is the first pad to be bonded. Pick-and-place and all component assembly

are recommended to be performed in ESD protected area.

Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The

coordinates may vary depending on sawing width and location. However, the distances between pads are

accurate.

IC OUTLINES

1260 um

840 um

Die Map Reference

XIN

VDD

VC

XOUT

XPD

OUT

VSS

MAS6283

Figure 2. IC outline of MAS6283.

Note1: Die map reference is the actual left bottom corner of the sawn chip.

Note2: See coordinates in pin description.

Note3: Die dimensions include 80 µm scribes for both sides. The actual dimensions are a bit less due to the saw

width.