ACT366

Rev 1, 14-Nov-12

Innovative Power

TM

- 2 -

www.active-semi.com

Copyright © 2012 Active-Semi, Inc.

PIN CONFIGURATION

PIN DESCRIPTIONS

PART NUMBER

TEMPERATURE RANGE

PACKAGE

PINS

PACKING

METHOD

TOP MARK

ACT366YH-T

-40°C to 85°C

SOP-8/EP

8

TAPE & REEL

ACT366YH

ORDERING INFORMATION

SOP-8/EP

ACT366YH

PIN

NAME

DESCRIPTION

1

SW

Switch Drive. Switch node for the external NPN transistor. Connect this pin to the external power

NPN’s emitter. This pin also supplies current to VDD during startup.

2,4,7

GND

Ground.

8

BD

Base Drive. Base driver for the external NPN transistor.

6

VDD

Power Supply. This pin provides bias power for the IC during startup and steady state operation.

5

FB

Feedback Pin. Connect this pin to a resistor divider network from the auxiliary winding.

3

CS

detailed information, see Application Information.

EP

EP

Exposed Pad shown as dashed box. The exposed thermal pad should be connected to board

ground plane and pin 4. The ground plane should include a large exposed copper pad under the

package for thermal dissipation (see package outline). The leads and exposed pad should be

flush with the board, without offset from the board surface.