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ACT2103 数据表(PDF) 9 Page - Active-Semi, Inc |
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ACT2103 数据表(HTML) 9 Page - Active-Semi, Inc |
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9 / 16 page ![]() ACT2103 Rev 2, 23-May-12 ® Innovative PowerTM - 9 - www.active-semi.com Copyright © 2012 Active-Semi, Inc. PC Board Layout Guidance When laying out the printed circuit board, the following checklist should be used to ensure proper operation of the IC. 1) Arrange the power components to reduce both the AC loop and DC loop size. AC loop includes input cap, VIN pin and VIN ground pin, DC loop includes SW pin, inductor, output capacitor and ground pin. 2) Place input decoupling ceramic capacitor CIN as close to IN pin as possible. CIN is connected power GND with vias or short and wide path. 3) Return FB, COMP and ISET to signal GND pin, and connect the signal GND to power GND at a single point for best noise immunity. 4) Use copper plane for power GND for best heat dissipation and noise immunity. 5) Place feedback resistor close to FB pin. 6) Use short trace connecting HSB-CHSB-SW loop Figure 3 shows an example of PCB layout. Figure 4 and Figure 5 give two typical car charger application schematics and associated BOM list. Figure 3: PCB Layout |
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