DS3231_13 datasheet(2/20 Pages) MAXIM

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Extremely Accurate I2C-Integrated

RTC/TCXO/Crystal

Maxim Integrated

DS3231

ABSOLUTE MAXIMUM RATINGS

RECOMMENDED OPERATING CONDITIONS

(TA = TMIN to TMAX, unless otherwise noted.) (Notes 2, 3)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

Voltage Range on Any Pin Relative to Ground......-0.3V to +6.0V

Junction-to-Ambient Thermal Resistance (

θJA) (Note 1)....73°C/W

Junction-to-Case Thermal Resistance (

θJC) (Note 1) ......23°C/W

Operating Temperature Range

DS3231S ..............................................................0°C to +70°C

DS3231SN ........................................................-40°C to +85°C

Junction Temperature ......................................................+125°C

Storage Temperature Range ...............................-40°C to +85°C

Lead Temperature (soldering, 10s) .................................+260°C

Soldering Temperature (reflow, 2 times max)..................+260°C

(See the

Handling, PC Board Layout, and Assembly section.)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

VCC

2.3

3.3

5.5

Supply Voltage

VBAT

2.3

3.0

5.5

Logic 1 Input SDA, SCL

VIH

0.7 x

VCC

VCC +

0.3

Logic 0 Input SDA, SCL

VIL

-0.3

0.3 x

VCC

ELECTRICAL CHARACTERISTICS

(VCC = 2.3V to 5.5V, VCC = Active Supply (see Table 1), TA = TMIN to TMAX, unless otherwise noted.) (Typical values are at VCC =

3.3V, VBAT = 3.0V, and TA = +25°C, unless otherwise noted.) (Notes 2, 3)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

VCC = 3.63V

200

Active Supply Current

ICCA

(Notes 4, 5)

VCC = 5.5V

300

μA

VCC = 3.63V

110

Standby Supply Current

ICCS

I2C bus inactive, 32kHz

output on, SQW output off

(Note 5)

VCC = 5.5V

170

μA

VCC = 3.63V

575

Temperature Conversion Current

ICCSCONV

I2C bus inactive, 32kHz

output on, SQW output off

VCC = 5.5V

650

μA

Power-Fail Voltage

VPF

2.45

2.575

2.70

Logic 0 Output, 32kHz,

INT/SQW, SDA

VOL

IOL = 3mA

0.4

Logic 0 Output,

RST

VOL

IOL = 1mA

0.4

Output Leakage Current 32kHz,

INT/SQW, SDA

ILO

Output high impedance

-1

μA

Input Leakage SCL

ILI

-1

μA

RST Pin I/O Leakage

IOL

RST high impedance (Note 6)

-200

+10

μA

VBAT Leakage Current

(VCC Active)

IBATLKG

100

Note 1:

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

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