–3–

REV. B

AD8024

ABSOLUTE MAXIMUM RATINGS

*

Internal Power Dissipation

Small Outline (R) ..... 1.0 Watts (Observe Derating Curve)

Input Voltage (Common Mode) ...................

Differential Input Voltage ...............

±3 V (Clamped)

Output Voltage Limit

Output Short Circuit Duration

...................... Observe Power Derating Curve

Storage Temperature Range

R Package ........................ –65

°C to +125°C

Operating Temperature Range

AD8024A .......................... –40

°C to +85°C

Lead Temperature Range (Soldering 10 sec) ......... 300

°C

*Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

ORDERING GUIDE

Temperature

Package

Package

Model

Range

Description

Option

AD8024AR-16

–40

°C to +85°C 16-Lead Narrow-Body R-16A

SOIC

Maximum Power Dissipation

The maximum power that can be safely dissipated by the AD8024

is limited by the associated rise in junction temperature. The

maximum safe junction temperature for the plastic encapsulated

parts is determined by the glass transition temperature of the

plastic, about 150

°C. Temporarily exceeding this limit may

cause a shift in parametric performance due to a change in the

stresses exerted on the die by the package. Exceeding a junction

temperature of 175

°C for an extended period can result in

device failure.

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although

the AD8024 features proprietary ESD protection circuitry, permanent damage may occur on

devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are

recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

Output Short Circuit Limit

The AD8024’s internal short circuit limitation is not sufficient

to protect the device in the event of a direct short circuit be-

source or sink current and therefore impact the device’s ability

to drive a load. Short circuits of extended duration can cause

metal lines to fuse open, rendering the device nonfunctional.

To prevent these problems, it is recommended that a series

resistor be placed as close as possible to the outputs. This will

serve to substantially reduce the magnitude of the fault currents

and protect the outputs from damage caused by intermittent

short circuits. This may not be enough to guarantee that the

maximum junction temperature (150

°C) is not exceeded under

all conditions. To ensure proper operation, it is necessary to

observe the maximum power derating curve in Figure 2.

It must also be noted that in (noninverting) gain configurations

(with low values of gain resistor), a high level of input overdrive

can result in a large input error current, which may then result

in a significant power dissipation in the input stage. This power

must be included when computing the junction temperature rise

due to total internal power.

AMBIENT TEMPERATURE – C

2.5

2.0

0.5

–50

90

–40 –30 –20

0

10 20

30

40 50

60 70

80

1.5

1.0

–10

16-LEAD SOIC

Figure 2. Maximum Power Dissipation vs. Ambient

Temperature

Model

Conditions

Min

Typ

Max

Unit

DISABLE CHARACTERISTICS

Off Isolation

f = 6 MHz

49

dB

Off Output Impedance

20

pF

Turn-On Time

25

ns

Turn-Off Time

20

ns

Switching Threshold

1.3

1.6

1.9

V

OPERATING TEMPERATURE RANGE

–40

+85

°C

Specifications subject to change without notice.