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0453003.MR 数据表(PDF) 3 Page - Littelfuse |
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0453003.MR 数据表(HTML) 3 Page - Littelfuse |
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3 / 4 page ![]() 59 © 2009 Littelfuse, Inc. Specifications are subject to change without notice. Surface Mount Fuses 451/453 Series NANO2® > Very Fast-Acting > 451/453 Series Please refer to www.littelfuse.com/series/451.html or /453.html for current information. Average Time Current Curves Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (T s(min)) 150°C - Temperature Max (T s(max)) 200°C - Time (Min to Max) (t s) 60 – 120 secs Average ramp up rate (Liquidus Temp (T L) to peak 5°C/second max. T S(max) to TL - Ramp-up Rate 5°C/second max. Reflow - Temperature (T L) (Liquidus) 217°C - Temperature (t L) 60 – 90 seconds Peak Temperature (T P) 250+0/-5 °C Time within 5°C of actual peak Temperature (t p) 20 – 40 seconds Ramp-down Rate 5°C/second max. Time 25°C to peak Temperature (T P) 8 minutes max. Do not exceed 260°C Soldering Parameters Temperature Rerating Curve 1000.000 100 10 1 0.1 0.01 0.001 0.05 0.1 110100 1000 CURRENT IN AMPERES Note: 1.Deratingdepictedinthiscurveisinadditiontothestandardderatingof25%for continuous operation. Wave Soldering Parameters 260°CPeak Temperature, 10 seconds max. Time TP TL TS(max) TS(min) 25 tP tL tS time to peak temperature (t 25ºC to peak) Ramp-down Ramp-up Preheat Critical Zone TL to TP |
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