®

© Coilcraft, Inc. 2012

1102 Silver Lake Road

Cary, IL 60013

Phone 800-981-0363

Fax 847-639-1508

Email cps@coilcraft.com

www.coilcraft-cps.com

This product may not be used in medical or high

risk applications without prior Coilcraft approval.

Specifications subject to change without notice.

Please check our web site for latest information.

1010 POWER INDUCTORS

±20% (µH)

typ

max

min

typ

20°C rise

40°C rise

MS611PYA221MSZ

0.22

0.33

0.37

92

115

98.8

30.8

41.6

MS611PYA451MSZ

0.45

0.60

0.66

53

66

70.5

30.0

39.8

MS611PYA102MSZ

1.0

1.00

1.10

34

42

55.0

24.0

32.6

MS611PYA152MSZ

1.5

1.60

1.76

26

33

36.6

23.3

30.4

MS611PYA222MSZ

2.2

2.55

2.80

18

22

34.0

18.4

24.0

MS611PYA332MSZ

3.3

3.70

4.10

17

21

27.4

13.7

18.8

MS611PYA472MSZ

4.7

5.20

5.70

15

19

25.4

13.1

18.0

MS611PYA562MSZ

5.6

6.30

6.93

13

16

23.6

11.8

15.9

MS611PYA682MSZ

6.8

8.10

8.90

11

14

21.8

10.5

13.9

MS611PYA822MSZ

8.2

11.70

12.90

9

12

18.3

9.7

12.8

MS611PYA103MSZ

10

13.40

14.75

8

11

17.5

8.6

11.6

MS611PYA153MSZ

15

16.90

18.60

7

9

15.5

7.4

10.4

1. When ordering, please specify

testing code:

MS611PYA682MSZ

Testing:

Z = COTS

H = Screening per Coilcraft CP-SA-10001

N = Screening per Coilcraft CP-SA-10004

2. Inductance tested at 100 kHz, 0.1 Vrms, 0 Adc.

3. DCR measured on a micro-ohmmeter.

4. SRF measured using an Agilent/HP 4395A or equivalent.

5. Typical dc current at which the inductance drops 30% from its value without current.

6. Typical current that causes the specified temperature rise from 25°C ambient.

7. Electrical specifications at 25°C.

Refer to Doc 362 “Soldering Surface Mount Components” before soldering.

Core material Composite

Terminations Tin-lead (63/37) over copper.

Weight 5.7 – 6.3 g

Ambient temperature –55°C to +105°C with Irms current, +105°C

to +155°C with derated current

Storage temperature Component: –55°C to +155°C.

Tape and reel packaging: –55°C to +80°C

Resistance to soldering heat Max three 40 second reflows at

+260°C, parts cooled to room temperature between cycles

Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C /

85% relative humidity)

Enhanced crush-resistant packaging 300/13

″ reel

Plastic tape: 24 mm wide, 0.4 mm thick, 16 mm pocket spacing,

10.21 mm pocket depth

■

High temperature materials allow operation in ambient

temperatures up to 155°C

■

Tin-lead (Sn-Pb) termination for the best possible board

adhesion

■

High current and very low DCR

■

Soft saturation makes them ideal for VRM/VRD applications.

Irms Testing

Irms testing was performed on a

0.060

″ thick pcb with 4 oz. copper

traces optimized to minimize

additional temperature rise.

Temperature rise is highly

dependent on many factors

including pcb land pattern,

trace size, and proximity to

other components. Therefore

temperature rise should be

verified in application conditions.

Document MS804-1 Revised 08/14/12