DAC16

REV. B

–3–

CAUTION

1. Stresses above those listed under “Absolute Maximum Rat-

ings” may cause permanent damage to the device. This is a

stress rating only and functional operation at or above this

specification is not implied. Exposure to the above maximum

rating conditions for extended periods may affect device

reliability.

2. Digital inputs and outputs are protected; however, perma-

nent damage may occur on unprotected units from high en-

ergy electrostatic fields. Keep units in conductive foam or

packaging at all times until ready to use. Use proper anti-

static handling procedures.

3. Remove power before inserting or removing units from their

sockets.

PIN CONFIGURATION

24-Lead DIP (P, S)

TOP VIEW

(Not to Scale)

24

23

22

21

20

19

18

17

16

15

14

13

1

2

3

4

5

6

7

8

9

10

11

12

DAC16

DGND

DB15 (MSB)

DB14

DB13

DB12

DB11

DB10

DB9

DB8

DB7

AGND

REF GND

DB0 (LSB)

DB1

DB2

DB3

DB4

DB5

DB6

PIN DESCRIPTION

Pin

(P, S) Name

Description

Reference Current Input

2

DGND

Digital Ground

+5 V Digital Supply

4–19

DB15–DB0 16-Bit Digital Input Bus. DB15 is the MSB.

20

–15 V Analog Supply

21

REF GND

Reference Current Return

22

AGND

Analog Ground/Output Reference

23

Current Output

24

Current Ladder Compensation

ORDERING GUIDE

Model

Grade DNL (max)

Temperature Ranges

Package Descriptions

Package Options

DAC16GS

±10°C to +70°C

24-Lead SOL

R-24

DAC16FP

±2

–40

°C to +85°C

24-Lead PDIP

N-24

DAC16FS

±2

–40

°C to +85°C

24-Lead SOL

R-24

DAC16GBC

±1

+25

°CDie

ABSOLUTE MAXIMUM RATINGS

DGND to AGND . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +0.3 V

REF GND to AGND . . . . . . . . . . . . . . . . . . . –0.3 V, +1.0 V

Analog Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . 8 mA

Digital Input Voltage to DGND . . . . . . . . . . . . . . . . . . .

≤V

CC

Operating Temperature Range

FP, FS . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40

°C to +85°C

GS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0

°C to +70°C

Dice Junction Temperature . . . . . . . . . . . . . . . . . . . . . +150

°C

Storage Temperature . . . . . . . . . . . . . . . . . . –65

°C to +150°C

Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . 1000 mW

Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300

°C

Package Type

θ

JA

1

θ

JC

Units

24-Lead Plastic DIP (P)

62

32

°C/W

24-Lead Plastic SOL (S)

70

22

°C/W

NOTE

1

θ

device in socket.

DICE CHARACTERISTICS

DGND

REF GND

DB0 (LSB)

DB1

DB2

DB3

DB4

DB5

DB6

DB7

DB8

DB9

DB10

DB11

DB12

DB13

DB14

DB15 (MSB)

Die Size 0.129 x 0.153 inch, 19,737 sq. mils

(3.277 x 3.886 mm, 12.73 sq. mm)

The DAC16 Contains 330 Transistors.