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TPS22981RGPR 数据表(PDF) 2 Page - Texas Instruments |
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TPS22981RGPR 数据表(HTML) 2 Page - Texas Instruments |
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2 / 19 page ![]() Top View/Footprint Bottom View Package Size: 4mm x 4mm x 1mm height Pad Pitch: 0.5mm 15 14 13 12 11 ENHVU S0 V3P3OUT V3P3 V3P3 V3P3 V3P3 V3P3OUT S0 ENHVU 15 14 13 12 11 TPS22981 SLVSBM6 – DECEMBER 2012 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION PART NUMBER PACKAGE MARKING PACKAGE DEVICE SPECIFIC FEATURES TPS22981RGPR PS22981 RGP Tape and Reel DISSIPATION RATINGS PACKAGE THERMAL RESISTANCE(1) POWER RATING(1) POWER RATING(1) DERATING FACTOR ABOVE(2) θJA TA = 25°C TA = 70°C TA = 25°C RGP 39.3°C/W 2.16W 1.02W 25.4mW/°C (1) Simulated with high-K board (2) Maximum power dissipation is a function of TJ(max), θJA and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA) / θJA. 2 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: TPS22981 |
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