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PM1012GP 数据表(PDF) 3 Page - Analog Devices |
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PM1012GP 数据表(HTML) 3 Page - Analog Devices |
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3 / 4 page ![]() PM1012 –3– REV. C ABSOLUTE MAXIMUM RATINGS 1 Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 V Input Voltage2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 V Differential Input Voltage3 . . . . . . . . . . . . . . . . . . . . . . ±1 V Differential Input Current3 . . . . . . . . . . . . . . . . . . . . ±10 mA Output Short-Circuit Duration . . . . . . . . . . . . . . . . Indefinite Operating Temperature Range PM1012G (P, S) . . . . . . . . . . . . . . . . . . . . –40 °C to +85°C Storage Temperature Range . . . . . . . . . . . . –65 °C to +150°C Junction Temperature Range . . . . . . . . . . . . –65 °C to +150°C Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . +300 °C Package Type JA 4 JC Units 8-Lead Plastic DIP (P) 103 43 °C/W 8-Lead SO (S) 158 43 °C/W ORDERING GUIDE Temperature Package Package Model Range Description Options PM1012GP –40 °C to +85°C Plastic DIP N-8 PM1012GS –40 °C to +85°C SOIC SO-8 CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the PM1012 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE NOTES 1Absolute maximum ratings apply to both DICE and packaged parts, unless otherwise noted. 2For supply voltages less than ±20 V, the absolute maximum input voltage is equal to the supply voltage. 3The PM1012’s inputs are protected by back-to-back diodes. Current-limiting resistors are not used in order to achieve low noise. Differential input voltages greater than 1 V will cause excessive current to flow through the input protection diodes unless limiting resistance is used. 4 θ JA is specified for worst case mounting conditions, i.e., θJA is specified for device in socket for cerdip, and P-DIP packages; θ JA is specified for device soldered to printed circuit board for SO package. |
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