SSM2402/SSM2412

REV. A

–3–

ABSOLUTE MAXIMUM RATINGS

Operating Temperature Range . . . . . . . . . . . –40

°C to +85°C

Operating Supply Voltage Range . . . . . . . . . . . . . . . . .

±20 V

Analog Input Voltage Range

Continuous . . . . . . . . . . . . . . V– +3.5 V

≤ V

A

≤ V+ –3.5 V

Maximum Current Through Switch . . . . . . . . . . . . . . 20 mA

Logic Input Voltage Range . . . . . . . . . . . . V+ Supply to –2 V

V+ Supply to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . +36 V

V– Supply to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . –20 V

Package Type

JC

Units

14-Pin Plastic DIP (P)

76

33

°C/W

16-Pin SOL (S)

92

27

°C/W

*

θ

in socket for P-DIP package;

θ

board for SOL package.

Timing Diagram

ORDERING GUIDE

Temperature

Package

Model

Range

Description

SSM2402P

–40

°C to +85°C

14-Pin Plastic DIP

SSM2402S

–40

°C to +85°C

16-Pin SOL

SSM2412P

–40

°C to +85°C

14-Pin Plastic DIP

SSM2412S

–40

°C to +85°C

16-Pin SOL

DICE CHARACTERISTICS

Die Size 0.105

× 0.097 Inch, 10,185 sq. mils

(2.667

× 2.464 mm, 6.57 sq. mm)

WAFER TEST LIMITS

Parameter

Symbol

Conditions

1

Limit

Units

POSITIVE SUPPLY CURRENT

7.5

mA max

NEGATIVE SUPPLY CURRENT

6.0

mA max

GROUND CURRENT

1.5

mA max

LOGIC INPUT CURRENT

2

5.0

µA max

SWITCH ON RESISTANCE

–14.2 V

≤ V

A

≤ +14.2 V

85

Ω max

±10 mA, V

–14.2 V

≤ V

A

≤ +14.2 V

5

% max

SWITCH ON LEAKAGE CURRENT

–14.2 V

≤ V

A

≤ +14.2 V, V

1.0

µA max

SWITCH OFF LEAKAGE CURRENT

–14.2 V

≤ V

A

≤ +14.2 V, V

1.0

µA max

NOTES

Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not

guaranteed for standard product dice. Consult factory to negotiate specifications based on dice lot qualifications through sample lot assembly and testing.