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LTC3603 数据表(PDF) 12 Page - Linear Technology |
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LTC3603 数据表(HTML) 12 Page - Linear Technology |
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12 / 16 page ![]() LTC3621/LTC3621-2 12 3621f For more information www.linear.com/LTC3621 applicaTions inForMaTion 2. The switching current is the sum of the MOSFET driver and control currents. The power MOSFET driver current resultsfromswitchingthegatecapacitanceofthepower MOSFETs. Each time a power MOSFET gate is switched from low to high to low again, a packet of charge dQ moves from IN to ground. The resulting dQ/dt is a cur- rent out of IN that is typically much larger than the DC control bias current. In continuous mode, IGATECHG = f(QT + QB), where QT and QB are the gate charges of the internal top and bottom power MOSFETs and f is the switching frequency. The power loss is thus: Switching Loss = IGATECHG • VIN The gate charge loss is proportional to VIN and f and thus their effects will be more pronounced at higher supply voltages and higher frequencies. 3. Other “hidden” losses such as transition loss and cop- per trace and internal load resistances can account for additional efficiency degradations in the overall power system. It is very important to include these “system” level losses in the design of a system. Transition loss arises from the brief amount of time the top power MOSFET spends in the saturated region during switch node transitions. The LTC3621 internal power devices switch quickly enough that these losses are not sig- nificant compared to other sources. These losses plus other losses, including diode conduction losses during dead-time and inductor core losses, generally account for less than 2% total additional loss. Thermal Conditions In a majority of applications, the LTC3621 does not dis- sipate much heat due to its high efficiency and low thermal resistance of its exposed pad package. However, in ap- plications where the LTC3621 is running at high ambient temperature, high VIN, high switching frequency, and maximum output current load, the heat dissipated may exceed the maximum junction temperature of the part. If the junction temperature reaches approximately 160°C, bothpowerswitcheswillbeturnedoffuntilthetemperature drops about 15°C cooler. To avoid the LTC3621 from exceeding the maximum junc- tion temperature, the user will need to do some thermal analysis. The goal of the thermal analysis is to determine whether the power dissipated exceeds the maximum junction temperature of the part. The temperature rise is given by: TRISE = PD • θJA As an example, consider the case when the LTC3621 is used in applications where VIN = 12V, IOUT = 1A, f = 2.25MHz, VOUT = 1.8V. The equivalent power MOSFET resistance RSW is: RSW =RDS(ON)TOP • VOUT VIN +RDS(ON)BOT • 1– VOUT VIN =370mΩ• 1.8V 12V +150mΩ • 1– 1.8V 12V =183m Ω The VIN current during 2.25MHz force continuous opera- tion with no load is about 5mA, which includes switching and internal biasing current loss, transition loss, inductor core loss and other losses in the application. Therefore, the total power dissipated by the part is: PD = IOUT2 • RSW + VIN • IIN(Q) = 1A2 • 183mΩ + 12V • 5mA = 243mW TheDFN2mm ×3mmpackagejunction-to-ambientthermal resistance, θJA, is around 64°C/W. Therefore, the junction temperature of the regulator operating in a 25°C ambient temperature is approximately: TJ = 0.243W • 64°C/W + 25°C = 40.6°C Remembering that the above junction temperature is obtained from an RDS(ON) at 25°C, we might recalculate the junction temperature based on a higher RDS(ON) since it increases with temperature. Redoing the calculation assuming that RSW increased 5% at 40.6°C yields a new |
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