MMDF2N06VL

2

Motorola TMOS Power MOSFET Transistor Device Data

Characteristic

Symbol

Min

Typ

Max

Unit

OFF CHARACTERISTICS

Drain–to–Source Breakdown Voltage

(VGS = 0 Vdc, ID = 0.25 mAdc)

Temperature Coefficient (Positive)

V(BR)DSS

60

—

—

66

—

—

Vdc

mV/

°C

Zero Gate Voltage Drain Current

(VDS = 60 Vdc, VGS = 0 Vdc)

(VDS = 60 Vdc, VGS = 0 Vdc, TJ = 150°C)

IDSS

—

—

—

—

10

100

µAdc

Gate–Body Leakage Current (VGS = ± 15 Vdc, VDS = 0 Vdc)

IGSS

—

—

100

nAdc

ON CHARACTERISTICS(1)

Gate Threshold Voltage

(VDS = VGS, ID = 250 µAdc)

Threshold Temperature Coefficient (Negative)

VGS(th)

1.0

—

1.5

3.0

2.0

—

Vdc

mV/

°C

Static Drain–to–Source On–Resistance

(VGS = 5.0 Vdc, ID = 2.5 Adc)

RDS(on)

—

0.12

0.13

Ohm

Drain–to–Source On–Voltage

(VGS = 5.0 Vdc, ID = 2.5 Adc)

(VGS = 5.0 Vdc, ID = 1.25 Adc, TJ = 150°C)

VDS(on)

—

—

—

—

0.4

0.3

Vdc

Forward Transconductance (VDS = 15 Vdc, ID = 1.25 Adc)

gFS

1.0

3.0

—

Mhos

DYNAMIC CHARACTERISTICS

Input Capacitance

(VDS = 25 Vdc, VGS = 0 Vdc,

f = 1.0 MHz)

Ciss

—

340

480

pF

Output Capacitance

(VDS = 25 Vdc, VGS = 0 Vdc,

f = 1.0 MHz)

Coss

—

110

150

Transfer Capacitance

f = 1.0 MHz)

Crss

—

27

50

SWITCHING CHARACTERISTICS(2)

Turn–On Delay Time

(VDD = 30 Vdc, ID = 2.5 Adc,

VGS = 5.0 Vdc,

RG = 9.1 Ω)

td(on)

—

10

20

ns

Rise Time

(VDD = 30 Vdc, ID = 2.5 Adc,

VGS = 5.0 Vdc,

RG = 9.1 Ω)

tr

—

30

60

Turn–Off Delay Time

VGS = 5.0 Vdc,

RG = 9.1 Ω)

td(off)

—

32

60

Fall Time

G = 9.1 Ω)

tf

—

28

60

Gate Charge

(VDS = 48 Vdc, ID = 2.5 Adc,

VGS = 5.0 Vdc)

QT

—

11

20

nC

(VDS = 48 Vdc, ID = 2.5 Adc,

VGS = 5.0 Vdc)

Q1

—

1.5

—

(VDS = 48 Vdc, ID = 2.5 Adc,

VGS = 5.0 Vdc)

Q2

—

3.8

—

Q3

—

3.5

—

SOURCE–DRAIN DIODE CHARACTERISTICS

Forward On–Voltage(1)

(IS = 2.5 Adc, VGS = 0 Vdc)

(IS = 2.5 Adc, VGS = 0 Vdc, TJ =

150

°C)

VSD

—

—

0.84

0.67

1.2

—

Vdc

Reverse Recovery Time

(IS = 2.5 Adc, VGS = 0 Vdc,

dIS/dt = 100 A/µs)

trr

—

49

—

ns

(IS = 2.5 Adc, VGS = 0 Vdc,

dIS/dt = 100 A/µs)

ta

—

32

—

(IS = 2.5 Adc, VGS = 0 Vdc,

dIS/dt = 100 A/µs)

tb

—

17

—

Reverse Recovery Storage Charge

QRR

—

0.08

—

µC

(1) Pulse Test: Pulse Width

≤ 300 µs, Duty Cycle ≤ 2%.

(2) Switching characteristics are independent of operating junction temperature.