ADP1190ACBZ-R7 datasheet(4/12 Pages) AD

4 / 12 page

ADP1190

Data Sheet

Rev. 0 | Page 4 of 12

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

IN to GND

−0.3 V to +4.0 V

OUT to GND

−0.3 V to VIN

Sx to GND

−0.3 V to +4.0 V

Tx to GND

−0.3 V to +4.0 V

EN to GND

−0.3 V to +4.0 V

Continuous Load Switch Current

TA = 25°C

±1 A

TA = 85°C

±500 mA

Continuous Diode Current

−50 mA

Storage Temperature Range

−65°C to +150°C

Junction Temperature

+150°C

Operating Junction Temperature Range

−40°C to +125°C

Operating Ambient Temperature Range

−40°C to +85°C

Soldering Conditions

JEDEC J-STD-020

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL DATA

Absolute maximum ratings apply individually only, not in

combination. The ADP1190 can be damaged when the junction

temperature limits are exceeded. Monitoring ambient tempera-

ture does not guarantee that TJ is within the specified temperature

limits. In applications with high power dissipation and poor

thermal resistance, the maximum ambient temperature may

need to be derated.

In applications with moderate power dissipation and low PCB

thermal resistance, the maximum ambient temperature can

exceed the maximum limit as long as the junction temperature

is within specification limits. The junction temperature (TJ) of

the device is dependent on the ambient temperature (TA), the

power dissipation of the device (PD), and the junction-to-ambient

thermal resistance of the package (θJA).

Maximum junction temperature (TJ) is calculated from the

ambient temperature (TA) and power dissipation (PD) using the

formula

TJ = TA + (PD × θJA)

The junction-to-ambient thermal resistance (θJA) of the package

is based on modeling and calculation using a 4-layer board. The

junction-to-ambient thermal resistance is highly dependent on

the application and board layout. In applications where high maxi-

mum power dissipation exists, close attention to thermal board

design is required. The value of θJA may vary, depending on

PCB material, layout, and environmental conditions. The speci-

fied value of θJA is based on a 4-layer, 4 in. × 3 in. circuit board. See

JESD51-7 and JESD51-9 for detailed information on the board

construction. For additional information, see the AN-617

Application Note, Wafer Level Chip Scale Package, available at

www.analog.com.

ΨJB is the junction-to-board thermal characterization parameter

with units of °C/W. ΨJB of the package is based on modeling and

calculation using a 4-layer board. JESD51-12, Guidelines for

Reporting and Using Electronic Package Thermal Information,

states that thermal characterization parameters are not the same

as thermal resistances. ΨJB measures the component power

flowing through multiple thermal paths rather than through a

single path as in thermal resistance, θJB. Therefore, ΨJB thermal

paths include convection from the top of the package as well as

radiation from the package, factors that make ΨJB more useful

in real-world applications. Maximum junction temperature (TJ)

is calculated from the board temperature (TB) and power

dissipation (PD) using the formula

TJ = TB + (PD × ΨJB)

See JESD51-8 and JESD51-12 for more detailed information

about ΨJB.

THERMAL RESISTANCE

θJA and ΨJB are specified for the worst-case conditions, that is, a

device soldered in a circuit board for surface-mount packages.

Table 3. Thermal Resistance

Package Type

θJA

ΨJB

Unit

12-Ball WLCSP

130

29.2

°C/W

ESD CAUTION

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